Shanghai

 

Responsibilities:

In this position, you will be mainly working and focusing on mechanical and/or structural retention design and/or reliability analysis for Chipset/VR/CPU thermal solution on Server product. You will be working closely with supplier to make sure thermal solution is compatible to High Volume manufacture and cost effectively.

 

Requirements:

You should possess a Bachelor or a Master of Mechanical design, a Master of Mechanics degree or relative engineering and/or equivalent. Additional qualifications include:

- Three years mechanical design experience in IT or relative industry, deep understanding of the HVM and cost effective of the design

- Good Experience on design based on manufacturing process: stamping, injection, die cast and others

- Knowledge of Thermal solution manufacturing process: such as AL extrusion; stacked-fin and folded fin and others

- Capability of controlling schedule and deliver job on time

- Good English communication both in written and/or oral is required; self learning and proactive

- Strong structural and/or reliability background and experience would be an added advantage

- Knowledge of Server product Arch* and chipset and/or VRs in Server boards would be an added advantage

- Additional knowledge of thermal would be an added advantage