Beijing

 

1. Responsible for cooling solutions for Radio Base Station hardware.

2. Understand the requirements specifications from customer and system design, breakdown them into cooling solution level requirements.

3. Cooperate with Mechanical Designers and PCB Designers, to design cooling solutions, including climate units, fans, and heatsinks and so on.

4. To do thermal simulation for PCBs, enclosure of units and cabinets; provide analysis results of simulation and solutions for risks.

5. Study the latest thermal technologies and drive the implementation into the products.

6. Provide technical specification for outsourcing parts or units.

7. To optimize the climate units for manufacture and assembly and cooperate with engineers in global external vendors and Company factories.

8. Cooperate with the R&D Center Sourcing staff dealing with external vendors in technical aspects.

9. To cooperate with the global Company R&D designers, including but not limit to system design, radio & digital design, mechanical & thermal design, power design.

10. To do the root causes analysis of design & quality troubles and provide solutions.

11. To create innovative techniques and cooling solutions.

12. Establish, develop and continue to improve of design environment and ways of working for thermal design within the R&D Center.

 

1.      Master degree or above in Thermal Engineering or equivalent. (Required)

2.      Excellent theory knowledge of thermal theory and engineering, including calculation and simulation skills. (Required)

3.      Excellent knowledge of computer assistant simulation tools such as Icepak or Flotherm. (Required)

4.      Be proactive and accountable, result-oriented. (Required)

5.      Has logic mind and good at analysis. (Required)

6.      Good communication skills, think on others’ foot and willing to influence others. (Required)

7.      Fluent oral & written English. (Required)

8.      Good knowledge within Mechanical area. (Required)

9.      Good sense of material cost and manufactures process. (Preferred)

10.   Good knowledge within the EMC area. (Preferred)

11.   Research experience related to thermal/cooling design. (Preferred)

12.   Good knowledge of DFM( Design for manufacture) and DFA( Design for Assembly). (Preferred)

13.   Good understanding of telecom industry standards and key testing criteria. (Preferred)

14.   Basic knowledge of Wireless Communication systems. (Preferred)